31/Mar/2020 | 38101000 | Solder paste LFM-48W NH (IMT) -A 11.5% for soldering electronic circuit boards, main TP: Sn CAS 7440-31-5 (85.40%), Ag CAS 7440-22-4 (2.66%), Older CAS 7440-50-8 (0.44%). new 100%. | Japan | kg | 10.00 | 753.11 | 75.31 | View Importer | View Supplier |
31/Mar/2020 | 38101000 | SET-310 # & Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards & X07-001038 & New products 100% | Korea (Republic) | kg | 20.00 | 1,500.00 | 75.00 | View Importer | View Supplier |
31/Mar/2020 | 38101000 | JMIH06 # & Cream solder (Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic circuit boards) (3SL0000003- 01) 100% new goods | Korea (Republic) | kg | 50.00 | 3,650.00 | 73.00 | View Importer | View Supplier |
30/Mar/2020 | 38109000 | Welding fluxes used in the welding process of mobile phone boards (Alpha solder paste, OM353 T5 Alloy Sn96.5%, Ag 3.0%, Cu0.5%), 2FSN-K30062; HMC00-0095 | Singapore | kg | 35.00 | 2,397.50 | 68.50 | View Importer | View Supplier |
24/Mar/2020 | 38101000 | CA00300002 # & Solder paste S3X58-M650-3 solder paste contains Tin 82-88%, Silver 2-3%, Copper 0.1-1%, 2- (2-Hexyloxyethoxy) ethanol 2-4%, Diglyceryl tetraisostearate 1-3% (Sn, Ag, Cu, C10H22O3) | Japan | kg | 30.00 | 2,100.00 | 70.00 | View Importer | View Supplier |
24/Mar/2020 | 38101000 | Solder paste (in paste form, used for tin solder, main ingredient is Tin: Sn: 84.5%; Ag: 3%, Cu: 0.5%, Rosin: 11.4%; Glutaric acid: 0.3%; Adipic Acid: 0.3%) LFM 48W TM-HP (Y), brand new 100%. | Korea (Republic) | kg | 600.00 | 39,528.00 | 65.88 | View Importer | View Supplier |
24/Mar/2020 | 38101000 | Solder paste (in paste form, used for tin solder, main ingredient is Tin: Sn: 84.5%; Ag: 3%, Cu: 0.5%, Rosin: 11.4%; Glutaric acid: 0.3%; Adipic Acid: 0.3%) LFM 48U TM-HP, brand new 100%. | Korea (Republic) | kg | 40.00 | 2,854.00 | 71.35 | View Importer | View Supplier |
23/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-VM, ingredients: Sn, Ag, Cu., Used to connect components with electronic boards. | Japan | kg | 25.00 | 2,384.75 | 95.39 | View Importer | View Supplier |
18/Mar/2020 | 38101000 | Solder paste, brand M705-SHF, ingredient Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 400.00 | 24,000.00 | 60.00 | View Importer | View Supplier |
18/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-V, component Sn - Ag - Cu (0.5 Kg / vial), used to connect components with electronic boards, 100% new goods | Korea (Republic) | kg | 160.00 | 9,600.00 | 60.00 | View Importer | View Supplier |
17/Mar/2020 | 38101000 | Solder paste (in paste form, used for tin solder, main ingredient is Tin: Sn: 84.5%; Ag: 3%, Cu: 0.5%, Rosin: 11.4%; Glutaric acid: 0.3%; Adipic Acid: 0.3%) LFM 48W TM-HP (Y), brand new 100%. | Korea (Republic) | kg | 600.00 | 39,528.00 | 65.88 | View Importer | View Supplier |
17/Mar/2020 | 38101000 | Solder paste (in paste form, used for tin solder, main ingredient is Tin: Sn: 84.5%; Ag: 3%, Cu: 0.5%, Rosin: 11.4%; Glutaric acid: 0.3%; Adipic Acid: 0.3%) LFM 48U TM-HP, brand new 100%. | Korea (Republic) | kg | 40.00 | 2,854.00 | 71.35 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | Tin solder paste, paste paste formulations (containing tin metal powder, Ag, Cu, turpentine and additives) EFC-3C05-30-MH, ECOJOIN manufacturer, 100% new | Korea (Republic) | kg | 300.00 | 15,180.00 | 50.60 | View Importer | View Supplier |
16/Mar/2020 | 38101000 | Solder paste, paste formulations (containing tin metal powder Sn, Ag, Cu, turpentine and additives), EFC-3A10-30-MH, manufacturer ECOJOIN, 100% new. | Korea (Republic) | kg | 150.00 | 6,270.00 | 41.80 | View Importer | View Supplier |
13/Mar/2020 | 38109000 | Chemical preparations of the chemical industry used in metallurgy-AG-217-New 100% (converted chemistry in tk: 102598892431 / A12) | Korea (Republic) | kg | 1,000.00 | 2,401.00 | 2.40 | View Importer | View Supplier |