| 31/Mar/2020 | 38101000 | Solder paste LFM-48U TM-HP (ST) 30cc / pc, 40g for soldering electronic circuit boards, main TP: Sn CAS 7440-31-5 (82.99%), Ag CAS 7440-22-4 (2.58 %), Cu CAS 7440-50-8 (0.43%). new 100%. | Japan | bottle / jar / tube | 20.00 | 641.13 | 32.06 | View Importer | View Supplier |
| 31/Mar/2020 | 38101000 | Solder paste LFM-48W NH (IMT) -A 11.5% for soldering electronic circuit boards, main TP: Sn CAS 7440-31-5 (85.40%), Ag CAS 7440-22-4 (2.66%), Older CAS 7440-50-8 (0.44%). new 100%. | Japan | kg | 10.00 | 753.11 | 75.31 | View Importer | View Supplier |
| 31/Mar/2020 | 38101000 | Solder paste LFM-48W MR-NH (500G / PC), main ingredients: Sn 7440-31-5 (85.4%), Ag 7440-22-4 (2.66%), Cu 7440-50-8 (0.44 %), used for soldering electronic circuit boards, 100% new goods. | Japan | piece/pcs | 40.00 | 1,463.20 | 36.58 | View Importer | View Supplier |
| 24/Mar/2020 | 38101000 | CA00300002 # & Solder paste S3X58-M650-3 solder paste contains Tin 82-88%, Silver 2-3%, Copper 0.1-1%, 2- (2-Hexyloxyethoxy) ethanol 2-4%, Diglyceryl tetraisostearate 1-3% (Sn, Ag, Cu, C10H22O3) | Japan | kg | 30.00 | 2,100.00 | 70.00 | View Importer | View Supplier |
| 23/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-VM, ingredients: Sn, Ag, Cu., Used to connect components with electronic boards. | Japan | kg | 25.00 | 2,384.75 | 95.39 | View Importer | View Supplier |
| 19/Mar/2020 | 38101000 | V3518180B # & Welding compound solution LFM-48W NH, tp: Sn 84.92%, Ag 2.64%, Cu 0.44%, Rosin 6%, 2- (2- hexiloxyethoxy) ethanol 3.6%, caster oil 1.2% | Japan | g | 5,000.00 | 560.00 | 0.11 | View Importer | View Supplier |
| 19/Mar/2020 | 38101000 | V3518180B # & Welding compound solution LFM-48W NH, tp: Sn 84.92%, Ag 2.64%, Cu 0.44%, Rosin 6%, 2- (2- hexiloxyethoxy) ethanol 3.6%, caster oil 1.2% | Japan | g | 5,000.00 | 560.00 | 0.11 | View Importer | View Supplier |
| 11/Mar/2020 | 38101000 | Solder paste LFM-48U TM-HP (ST) 120gram / pc (main ingredient: Sn 7440-31-5 (82.99%), Ag 7440-22-4 (2.58%), Cu 7440-50-8 ( 0.43%)), used for soldering electronic circuit boards, new goods 100% .. | Japan | piece/pcs | 20.00 | 693.27 | 34.66 | View Importer | View Supplier |
| 06/Mar/2020 | 38101000 | Solder paste (PW233-ST355-GQ-4, 0.5kg / can, ingredient Sn 85.1%, Bi 2.7%, Cu 0.44%, Ag 0.27% and additives) | Japan | cans / can | 60.00 | 1,313.39 | 21.89 | View Importer | View Supplier |
| 05/Mar/2020 | 38101000 | V3630977A # & LFM-48U NH (E) 13% soldering solution, TP: Sn 83.95%, Ag 2.61%, Cu 0.44%, Rosin 6.5%, Glycol ether solvents 3.9%, additives 2.6% | Japan | g | 1,000.00 | 114.00 | 0.11 | View Importer | View Supplier |
| 04/Mar/2020 | 38101000 | Solder paste, brand M705-GRN360-K2-VM, ingredients: Sn, Ag, Cu., Used to connect components with electronic boards. | Japan | kg | 20.00 | 1,921.39 | 96.07 | View Importer | View Supplier |
| 21/Jan/2019 | 38101000 | DVLCT1820 # & Additive for plating - Preparations for cleaning metal surfaces - Plating additives - EBASOLDER AG , tp: containing Ag sal in acidic environment , CTHH: CH4O3S , 100% new | Japan | Lit | 80.00 | 9,446.40 | 118.08 | View Importer | View Supplier |
| 18/Jan/2019 | 38101000 | V3518180B # & Welding compound solution LFM-48W NH , tp: Sn 84.92% , Ag 2.64% , Cu 0.44% , Rosin 6% , 2- (2- hexiloxyethoxy) ethanol 3.6% , caster oil 1.2 % | Japan | G | 5,000.00 | 560.00 | 0.11 | View Importer | View Supplier |
| 18/Jan/2019 | 38101000 | V3630977A # & Welding compound solution LFM-48U NH (E) 13% , TP: Sn 83.95% , Ag 2.61% , Cu 0.44% , Rosin 6.5% , Glycol ether solvents 3.9% , additives 2.6% | Japan | G | 1,000.00 | 114.00 | 0.11 | View Importer | View Supplier |
| 17/Jan/2019 | 38101000 | LFM-48X TM-HP 12% solder paste contains Tin (Sn) 84.92%; Silver (Ag) 2.64%; Copper (Cu) 0.44%; Rosin (C20H30O2) 6%; Glycol Ether Solvent 3.6%; Additive 3.4% (1 bottle = 500g) | Japan | Bottle/Jar/Tube | 2.00 | 18.10 | 9.05 | View Importer | View Supplier |
