| 25/Jan/2019 | 38101000 | # & UNDERFILL Adhesive, UF-1083 (CODE AS70-0324 , Ingredients: Epoxy resin , polythiol resin , modified epoxy resin) , 100% new | Korea (Republic) | Bottle/Jar/Tube | 80.00 | 2,036.36 | 25.45 | View Importer | View Supplier |
| 10/Jan/2019 | 38109000 | Solder paste , used to attach components to the circuit board (360g / Bottle) SMT ADHESIVE , JU-100-2 (360G / AD CART) | Japan | Bottle/Jar/Tube | 5.00 | 470.00 | 94.00 | View Importer | View Supplier |
| 08/Jan/2019 | 38101000 | # & UNDERFILL Adhesive, UF-1083 (CODE AS70-0324 , Ingredients: Epoxy resin , polythiol resin , modified epoxy resin) , 100% new | Korea (Republic) | Bottle/Jar/Tube | 60.00 | 1,527.27 | 25.45 | View Importer | View Supplier |
| 07/Jan/2019 | 38101000 | Silicon adhesive for gluing , sealing products , OE7842P B (RS00055). New 100% | Korea (Republic) | G | 15,000.00 | 4,773.00 | 0.32 | View Importer | View Supplier |
| 03/Jan/2019 | 38101000 | Atstrip LAC I 20 - is a metal surface cleaning product used to peel off the colorless adhesive broken in the plating industry. CAS Number: 629-14-1; 497-19-8. 100% new | China | Lit | 50.00 | 300.00 | 6.00 | View Importer | View Supplier |
