| 30/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 6,000.00 | 21,873.60 | 3.65 | View Importer | View Supplier |
| 25/Mar/2020 | 35069900 | 5REZ00031A # & Adhesive components (SDD-100), including HYDROFLUOROETHER (80%), M-ENEHEXAFLUORIDE (10%), ACRYL POLYMER (10%), no precursors, 100% new. | Japan | g | 12,000.00 | 2,652.00 | 0.22 | View Importer | View Supplier |
| 23/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 6,000.00 | 21,873.60 | 3.65 | View Importer | View Supplier |
| 18/Mar/2020 | 35069900 | SEV006 # & CEMEDINE-SX720WH + Adhesive (ingredients: Silica, tetraethyl orthosilicate; Silicone modified polymer; Fillers; Paraffin; Organic tin compund) | Japan | g | 5,000.00 | 392.20 | 0.08 | View Importer | View Supplier |
| 13/Mar/2020 | 35069900 | 5REZ00031A # & Adhesive components (SDD-100), including HYDROFLUOROETHER (80%), M-ENEHEXAFLUORIDE (10%), ACRYL POLYMER (10%), no precursors, 100% new. | Japan | g | 12,000.00 | 2,652.00 | 0.22 | View Importer | View Supplier |
| 13/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 3,750.00 | 13,671.00 | 3.65 | View Importer | View Supplier |
| 06/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 3,750.00 | 13,671.00 | 3.65 | View Importer | View Supplier |
| 03/Mar/2020 | 35069900 | 5REZ00031A # & Adhesive components (SDD-100), including HYDROFLUOROETHER (80%), M-ENEHEXAFLUORIDE (10%), ACRYL POLYMER (10%), no precursors, 100% new. | Japan | g | 12,000.00 | 2,652.00 | 0.22 | View Importer | View Supplier |
| 02/Mar/2020 | 35069900 | 5CHJ00184A # & Adhesive components (SA2201DN-30G), components include: Bisphenol F type epoxy resin (liquid), Synthetic Resins, Bisphenol A type Epoxy Resin, Silica, Polymerization initiators. (1CC = 1G) .New 100% | Japan | g | 5,250.00 | 19,139.40 | 3.65 | View Importer | View Supplier |
| 25/Jan/2019 | 35069900 | V2383875 # & EP-330 Adhesive, Bisphenol A , polymer epichlorohydrin (90-100%) , Silica (1-5%) | Japan | G | 3,660.00 | 245.22 | 0.07 | View Importer | View Supplier |
| 09/Jan/2019 | 35069900 | SEV006 # & GRS-702GY Adhesive (ingredients: Bisphenol F / A polymer epichlorohydrin , Modified epoxy resin; Filler; Curing agent; Additive; Titatium dioxide; Carbon black) | Japan | G | 10,000.00 | 6,360.00 | 0.64 | View Importer | View Supplier |
