| 30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 5,000.00 | 9,350.00 | 1.87 | View Importer | View Supplier |
| 26/Mar/2020 | 34031919 | Cimtech 3150 VLZ lubricating oil (200 liters / barrel), Trietanolamin 20-25%, nonanoic acid 0.5-1.5%, water <70%, oil content <70%, does not contain Silicon. New 100% | Korea (Republic) | liter | 8,000.00 | 18,600.00 | 2.33 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 20.00 | 265.00 | 13.25 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 700.00 | 12,894.00 | 18.42 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 4,000.00 | 7,480.00 | 1.87 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 1,280.00 | 15,454.21 | 12.07 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 13/Mar/2020 | 34029013 | Substances used for surface treatment after copper plating SFCOAT Cu W Plus II B, Acetic acid content <20%, Ammonium hydroxide <25%, the remaining is water, NSX: Sun Faith Chemical co., Ltd. New 100% | China | liter | 170.00 | 1,411.00 | 8.30 | View Importer | View Supplier |
| 13/Mar/2020 | 38159000 | 07050507 # & CONDUCTRON DP-H Solution ACTIVATOR CONC. (J) contains 50-60% water, Stannous chloride 25-35%, Hydrochloric acid 10-20% and Palladium Compound 0.1-1% used as catalysts in industry | Japan | liter | 10.00 | 2,710.00 | 271.00 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | Copper Gleam HS-200B-1 solution contains Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% under item 13 tk 102727339300 on June 28, 2019 | Japan | liter | 0.83 | 11.00 | 13.25 | View Importer | View Supplier |
| 11/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 300.00 | 3,975.00 | 13.25 | View Importer | View Supplier |
