| 30/Mar/2020 | 38140000 | P29 # & Organic solvent mixture (SK-3F treated water) (main ingredients: Mek12-17%, Hexanedioic acid, polymer with 1,4-butanediol 10-14%, Ethyl acetate 25-30%, Acetone16- 22%) | Vietnam | kg | 600.00 | 1,399.98 | 2.33 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
| 27/Mar/2020 | 38140000 | 36 # & SK-3F water treatment (main ingredients: Mek12-17%, Hexanedioic acid, polymer with 1,4-butanediol 10-14%, Ethyl acetate 25-30%, Acetone16-22%) | Vietnam | kg | 255.00 | 499.80 | 1.96 | View Importer | View Supplier |
| 27/Mar/2020 | 38140000 | P29 # & Organic solvent mixture (SK-3F treated water) (main ingredients: Mek12-17%, Hexanedioic acid, polymer with 1,4-butanediol 10-14%, Ethyl acetate 25-30%, Acetone16- 22%) | Vietnam | kg | 1,350.00 | 3,149.96 | 2.33 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 5,000.00 | 9,350.00 | 1.87 | View Importer | View Supplier |
| 26/Mar/2020 | 34031919 | Cimtech 3150 VLZ lubricating oil (200 liters / barrel), Trietanolamin 20-25%, nonanoic acid 0.5-1.5%, water <70%, oil content <70%, does not contain Silicon. New 100% | Korea (Republic) | liter | 8,000.00 | 18,600.00 | 2.33 | View Importer | View Supplier |
| 26/Mar/2020 | 34031919 | Cimtech 3150 VLZ lubricating oil (200 liters / barrel), Trietanolamin 20-25%, nonanoic acid 0.5-1.5%, water <70%, oil content <70%, does not contain Silicon. New 100% | China | Box | 40.00 | 14,080.00 | 352.00 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | NPL137 # & Mixture of chemicals used in plating - COPPER GLEAM HS-200B-1 (Sulfuric Acid <1%, Copper Sufate 0.1% <1%, Stabilizer 15% <25%, Water 75% <85%) | Japan | ml | 60,000.00 | 618.00 | 0.01 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 20.00 | 265.00 | 13.25 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 700.00 | 12,894.00 | 18.42 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 4,000.00 | 7,480.00 | 1.87 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | PSCB-AUROTECH-CNN-PART A # & Chemical replenishment part a - replenishment part a (2130 / N3.13 / TD 25/11/2013). NICKEL, ACID, water, plating preparations (finishing substances). | Malaysia | kg | 120.00 | 1,054.80 | 8.79 | View Importer | View Supplier |
