| 30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 5,000.00 | 9,350.00 | 1.87 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 20.00 | 265.00 | 13.25 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 700.00 | 12,894.00 | 18.42 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 4,000.00 | 7,480.00 | 1.87 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 1,280.00 | 15,454.21 | 12.07 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | Copper Gleam HS-200B-1 solution contains Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% under item 13 tk 102727339300 on June 28, 2019 | Japan | liter | 0.83 | 11.00 | 13.25 | View Importer | View Supplier |
| 11/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 300.00 | 3,975.00 | 13.25 | View Importer | View Supplier |
| 06/Mar/2020 | 38249999 | NIKENTM NDL-5M plating solution (Chemical preparations for plating industry, ingredients: 30% Lactic acid, 25% Sodium phosphinate, 6% Ammonium hydroxide, 5% Adipic acid, and 34% water.) New arrivals 100 % (20L = can) | Korea (Republic) | liter | 1,280.00 | 7,859.20 | 6.14 | View Importer | View Supplier |
