| 31/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 500.00 | 6,625.00 | 13.25 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 200.00 | 2,650.00 | 13.25 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry | Japan | Lit | 640.00 | 6,173.92 | 9.65 | View Importer | View Supplier |
| 04/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry | Japan | Lit | 640.00 | 6,175.43 | 9.65 | View Importer | View Supplier |
| 03/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 640.00 | 8,480.00 | 13.25 | View Importer | View Supplier |
