| 30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | NPL137 # & Mixture of chemicals used in plating - COPPER GLEAM HS-200B-1 (Sulfuric Acid <1%, Copper Sufate 0.1% <1%, Stabilizer 15% <25%, Water 75% <85%) | Japan | ml | 60,000.00 | 618.00 | 0.01 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 20.00 | 265.00 | 13.25 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 700.00 | 12,894.00 | 18.42 | View Importer | View Supplier |
| 20/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 1,280.00 | 15,454.21 | 12.07 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | 0 # & Copper Gleam (TM) HS-200B-1 (J) solution used in plating containing Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 500.00 | 9,210.00 | 18.42 | View Importer | View Supplier |
| 12/Mar/2020 | 38249999 | Copper Gleam HS-200B-1 solution contains Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% under item 13 tk 102727339300 on June 28, 2019 | Japan | liter | 0.83 | 11.00 | 13.25 | View Importer | View Supplier |
| 11/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 300.00 | 3,975.00 | 13.25 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 500.00 | 6,625.00 | 13.25 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 200.00 | 2,650.00 | 13.25 | View Importer | View Supplier |
| 18/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry | Japan | Lit | 640.00 | 6,173.92 | 9.65 | View Importer | View Supplier |
