| 30/Mar/2020 | 38249999 | 07030109 # & Roughness solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) (22kg / can) | Japan | kg | 704.00 | 1,386.88 | 1.97 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Plating preparations (including sulfuric acid, copper sulphate, etc.) CUPRACID GS CORRECTION, CAS number: 7758-98-7; 7664-93-9; 27206-35-5 | Japan | kg | 900.00 | 1,307.91 | 1.45 | View Importer | View Supplier |
| 27/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 25/Mar/2020 | 38101000 | TOP ADD-320, TP: nitric acid, sulfuric acid 2.2%, hydrogen fluoride, liquid, new 100% (cas7697-37-2,7664-93-9,7664-39-3,7732-18 -5) (KQPTPL9148 / TB-TCHQ). FOC goods | Japan | kg | 275.00 | 1,107.80 | 4.03 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07040407 # & Rough MEC V-BOND BO-7790VP board (Sulfuric acid (H2SO4) 5-9%, Copper sulfate (CuSO4.5H2O) <1%) | Japan | kg | 640.00 | 940.80 | 1.47 | View Importer | View Supplier |
| 25/Mar/2020 | 38249999 | 07030109 # & Rough solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) | Japan | kg | 506.00 | 996.82 | 1.97 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 07040407 # & Rough MEC V-BOND BO-7790VP board (Sulfuric acid (H2SO4) 5-9%, Copper sulfate (CuSO4.5H2O) <1%) (20kg / can) | Japan | kg | 640.00 | 940.80 | 1.47 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 07030109 # & Roughness solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) (22kg / can) | Japan | kg | 704.00 | 1,386.88 | 1.97 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 07030109 # & Roughness solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) (22kg / can) | Japan | kg | 198.00 | 390.06 | 1.97 | View Importer | View Supplier |
| 19/Mar/2020 | 28070000 | KX1195 # & Sulfuric acid H2SO4 50% (sulfuric acid H2SO4 50%). Liquid form. New 100% | Japan | kg | 8,060.00 | 4,392.70 | 0.55 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | 07040407 # & Rough MEC V-BOND BO-7790VP board (Sulfuric acid (H2SO4) 5-9%, Copper sulfate (CuSO4.5H2O) <1%) (20kg / can) | Japan | kg | 640.00 | 940.80 | 1.47 | View Importer | View Supplier |
| 18/Mar/2020 | 38249999 | 07030109 # & Roughness solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) (22kg / can) | Japan | kg | 1,408.00 | 2,773.76 | 1.97 | View Importer | View Supplier |
| 17/Mar/2020 | 28070000 | Sulfuric acid solution (H2SO4 98% P). New 100% | Japan | kg | 600.00 | 648.65 | 1.08 | View Importer | View Supplier |
| 16/Mar/2020 | 28070000 | Sulfuric acid solution (20 Kgs) 90% CAS 7664-93-9 (H2SO4) (Imported by M1 Chemical checking account: 102492279521 February 20, 2019 | Japan | kg | 20.00 | 1,176.66 | 58.83 | View Importer | View Supplier |
| 16/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
