| 31/Mar/2020 | 38101000 | TRI Chemical, cleaning metal surfaces, used in metal plating process. Chemical ingredients: sulfuric acid 29% -35%, Proprietary additive mixture max 5% and water. New 100% | Japan | liter | 8,000.00 | 86,720.00 | 10.84 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | 07030109 # & Roughness solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) (22kg / can) | Japan | kg | 704.00 | 1,386.88 | 1.97 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | 07020113 # & JC-BRITE 211SF: The chemical preparations used in the galvanizing industry are TP salts of sulphated salts, additives in acidic environment (Sulfuric acid-H2SO4 0.7%, Polyoxyalkylene ether 19.2%, Copper sulfate0.2% | Japan | liter | 260.00 | 5,012.80 | 19.28 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Crimson Converter 5410 is a solution containing Sulfuric Acid 30-40%, Glycerine 5-15%, Hydroxylamine Sulfate 1-10% used in plating industry. | Japan | liter | 640.00 | 5,958.91 | 9.31 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 340.00 | 3,065.32 | 9.02 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | PT02005 # & Tin thickness test solution (Tp: Isopropyl Alcohol 10%, Stannous Sulfate 10%, Sulfuric Acid 10%) (1 bottle = 100ml) | Japan | bottle / jar / tube | 3.00 | 268.95 | 89.65 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Plating preparations (including sulfuric acid, copper sulphate, etc.) CUPRACID GS CORRECTION, CAS number: 7758-98-7; 7664-93-9; 27206-35-5 | Japan | kg | 900.00 | 1,307.91 | 1.45 | View Importer | View Supplier |
| 28/Mar/2020 | 28070000 | 0 # & Sulfuric acid 95% (CAS: 7664-93-9) (1kg / bottle), brand new 100% | Japan | bottle / jar / tube | 14.00 | 79.59 | 5.68 | View Importer | View Supplier |
| 27/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1can = 20 Liter) | Japan | liter | 1,280.00 | 40,396.80 | 31.56 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | Copper Gleam HVS-202A (J) copper plating surface brightening solution (water 90-99%; Formaldehyde 0.1-1%; Organic sulfur compound 0.1-1%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1 can = 20 Liters) | Japan | liter | 960.00 | 20,160.00 | 21.00 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 26/Mar/2020 | 28070000 | Chemical: Sulfuric acid (Used in the experiment, 100% new) H2SO4, CAS: 7664-93-9, 1kg / bottle, total = 300kg # & JP | Japan | bottle / jar / tube | 300.00 | 2,172.60 | 7.24 | View Importer | View Supplier |
| 26/Mar/2020 | 38220090 | M2029900822, Titration Solution (3) (contains 5% sulfuric acid, CAS code: 7664-93-9) Used for analyzing chemical concentrations in material automatic analyzers, 10L / barrel, NSX: ISHIHARA, 100% new | Japan | Box | 2.00 | 550.90 | 275.45 | View Importer | View Supplier |
