| 27/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 5,000.00 | 9,350.00 | 1.87 | View Importer | View Supplier |
| 25/Mar/2020 | 28070000 | Sulfuric acid 98% - H2SO4. 100% new (GPNK: 2617TCCN / GP-HC issued on 24/03/2020 at the Department of Chemicals according to INV: CX20200215) | China | liter | 7,200.00 | 4,824.00 | 0.67 | View Importer | View Supplier |
| 25/Mar/2020 | 28070000 | Sulfuric acid 98% - H2SO4. 100% new (GPNK: GPNK: 2617TCCN / GP-HC issued on 24/03/2020 at the Department of Chemicals according to INV: CX20200215) | China | liter | 1,600.00 | 1,360.00 | 0.85 | View Importer | View Supplier |
| 24/Mar/2020 | 38249999 | 07030207 # & Nimuden NPR-8-D solution contains Sulfuric acid (H2SO4) 0.05%, Thionic Compound 0.01%, Acetic acid (C2H4O2) 0.2% is a chemical mixture used in electroplating | China | liter | 700.00 | 1,512.00 | 2.16 | View Importer | View Supplier |
| 23/Mar/2020 | 38249999 | 06320501 # & Purfield Copper Sulphate Solution 300G / L is a solution containing 75-85% water, Copper sulfate 15-25%, Sulfuric acid <1% used in electronics industry | China | liter | 4,000.00 | 7,480.00 | 1.87 | View Importer | View Supplier |
| 07/Mar/2020 | 38249999 | Preparations containing water 55-65%; Polyalkylene glycol 35-45%; Sulfuric acid 0.1-1%; Copper sulfate 0.1-1% for copper plating industry - Copper Gleam (TM) ST-901C | China | liter | 80.00 | 1,976.00 | 24.70 | View Importer | View Supplier |
| 06/Mar/2020 | 28070000 | Sulfuric acid chemical 97%, formula: H2SO4, (500Ml / Bottle), 0.5L / 1 bottle. New 100% | China | liter | 100.00 | 246.01 | 2.46 | View Importer | View Supplier |
| 03/Mar/2020 | 38249999 | 07030207 # & Nimuden NPR-8-D solution contains Sulfuric acid (H2SO4) 0.05%, Thionic Compound 0.01%, Acetic acid (C2H4O2) 0.2% is a chemical mixture used in electroplating | China | liter | 900.00 | 1,944.00 | 2.16 | View Importer | View Supplier |
