| 31/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 500.00 | 6,625.00 | 13.25 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry (20L / T-680kg) | Japan | Lit | 500.00 | 5,230.00 | 10.46 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0 , 1-1 %; Copper sulfate 0 , 1-1%) | Japan | Lit | 640.00 | 14,377.74 | 22.47 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Copper Gleam HVS-202A (J) copper-brightened surface brightening solution (water 90-99%; Formaldehyde 0 , 1-1%; Organic sulfur compound 0 , 1-1%; Sulfuric acid 0 , 1 -1%; Copper sulfate 0 , 1-1%) | Japan | Lit | 320.00 | 5,019.96 | 15.69 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | Crimson Converter 5410 is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry | Japan | Lit | 1,280.00 | 10,186.13 | 7.96 | View Importer | View Supplier |
| 30/Jan/2019 | 38249999 | CO GLEAM HVS-202BN (J) (VN) / 20L water-free 85- 95% , Polyalkylene glycol 5-15% , Polymer 1- 5% , Sulfuric acid> 0 , 1- <1% , Copper Sulfate> 0 , 1- <1%. improve plating capabilities in batches , increase board surface flatness | Japan | Lit | 200.00 | 4,688.63 | 23.44 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill (TM) EVF-C2 solution contains Sulfuric acid (H2SO4) 0 , 1-1% , Copper sulfate (CuSO4) 0 , 1-1% , Formaldehyde (CH2O) 0 , 1-1% , Polyalkyleneglycol used in plating industry 11095904 (20L / T) | Japan | Lit | 500.00 | 10,440.00 | 20.88 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-404kg) | Japan | Lit | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry (20L / T-680kg) | Japan | Lit | 500.00 | 5,230.00 | 10.46 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1% , Oxyalkylene Polymer 15-25% , Sulfuric acid 0 , 1-1% and water 75-85 % used in electronics industry (20L / T) | Japan | Lit | 200.00 | 2,650.00 | 13.25 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | MICROFILL THF 100 B-1 (TM) solution contains Water 90-99% , Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology ( 20L / T-303kg) | Japan | Lit | 300.00 | 11,148.00 | 37.16 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40% , Glycerine 5-15% , Hydroxylamine Sulfate 1-10% used in plating industry (20L / T-408kg) | Japan | Lit | 300.00 | 3,138.00 | 10.46 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | JC-BRITE 211STB: Chemical preparations for plating industry whose main components are sulphate salts and additives in acidic environments , T / parts: Sulfuric Acid -H2SO4 0.7% , Organic sulfur compound 0.2% | Japan | Lit | 640.00 | 9,280.00 | 14.50 | View Importer | View Supplier |
