30/Mar/2020 | 38249999 | 07030109 # & Roughness solution for MEC V-BOND board CB-7612H (Sulfuric acid (H2SO4) 30-35%; Cyclohexylamine (C6H13N) <5%) (22kg / can) | Japan | kg | 704.00 | 1,386.88 | 1.97 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | 07020113 # & JC-BRITE 211SF: The chemical preparations used in the galvanizing industry are TP salts of sulphated salts, additives in acidic environment (Sulfuric acid-H2SO4 0.7%, Polyoxyalkylene ether 19.2%, Copper sulfate0.2% | Japan | liter | 260.00 | 5,012.80 | 19.28 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Crimson Converter 5410 is a solution containing Sulfuric Acid 30-40%, Glycerine 5-15%, Hydroxylamine Sulfate 1-10% used in plating industry. | Japan | liter | 640.00 | 5,958.91 | 9.31 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 340.00 | 3,065.32 | 9.02 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | PT02005 # & Tin thickness test solution (Tp: Isopropyl Alcohol 10%, Stannous Sulfate 10%, Sulfuric Acid 10%) (1 bottle = 100ml) | Japan | bottle / jar / tube | 3.00 | 268.95 | 89.65 | View Importer | View Supplier |
30/Mar/2020 | 38249999 | Plating preparations (including sulfuric acid, copper sulphate, etc.) CUPRACID GS CORRECTION, CAS number: 7758-98-7; 7664-93-9; 27206-35-5 | Japan | kg | 900.00 | 1,307.91 | 1.45 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1can = 20 Liter) | Japan | liter | 1,280.00 | 40,396.80 | 31.56 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | Copper Gleam HVS-202A (J) copper plating surface brightening solution (water 90-99%; Formaldehyde 0.1-1%; Organic sulfur compound 0.1-1%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1 can = 20 Liters) | Japan | liter | 960.00 | 20,160.00 | 21.00 | View Importer | View Supplier |
27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020408 # & Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40%, Glycerine 5-15%, Hydroxylamine Sulfate 1-10% used in plating industry | Japan | liter | 280.00 | 2,928.80 | 10.46 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020124 # & Microfill Solution (TM) EVF-C2 contains Sulfuric acid (H2SO4) 0.1-1%, Copper sulfate (CuSO4) 0.1-1%, Formaldehyde (CH2O) 0.1-1%, Polyalkyleneglycol used in plating industry | Japan | liter | 1,000.00 | 20,880.00 | 20.88 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | NPL137 # & Mixture of chemicals used in plating - COPPER GLEAM HS-200B-1 (Sulfuric Acid <1%, Copper Sufate 0.1% <1%, Stabilizer 15% <25%, Water 75% <85%) | Japan | ml | 60,000.00 | 618.00 | 0.01 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 20.00 | 265.00 | 13.25 | View Importer | View Supplier |
26/Mar/2020 | 38249999 | 07020408 # & Crimson Converter 5410 (TM) is a solution containing Sulfuric Acid 30-40%, Glycerine 5-15%, Hydroxylamine Sulfate 1-10% used in plating industry | Japan | liter | 40.00 | 418.40 | 10.46 | View Importer | View Supplier |