| 30/Mar/2020 | 38249999 | Preparations used in plating to polish the surface of electroplated copper CUPROSTAR ST-2000 CORRECTOR (ingredients: sulfuric acid 1-10%, Organic salt 0.1-1%, copper su (according to ptpl No. 119 / TB-KĐHQ day) 10/05/2019) | Taiwan | liter | 200.00 | 5,200.00 | 26.00 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | MM04-005805 # & CU-BRITE KL-A ADDITIONAL SULFURIC ACID 0.7% | Korea (Republic) | liter | 2,880.00 | 41,019.84 | 14.24 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | MM04-005806 # & CU-BRITE ADDITIONAL KL-B SULFURIC ACID 0.7% | Korea (Republic) | liter | 2,560.00 | 36,462.08 | 14.24 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | MM04-005807 # & CU-BRITE ADDITIONAL KL-C SULFURIC ACID 0.7% | Korea (Republic) | liter | 1,600.00 | 22,788.80 | 14.24 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | 07020113 # & JC-BRITE 211SF: The chemical preparations used in the galvanizing industry are TP salts of sulphated salts, additives in acidic environment (Sulfuric acid-H2SO4 0.7%, Polyoxyalkylene ether 19.2%, Copper sulfate0.2% | Japan | liter | 260.00 | 5,012.80 | 19.28 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Crimson Converter 5410 is a solution containing Sulfuric Acid 30-40%, Glycerine 5-15%, Hydroxylamine Sulfate 1-10% used in plating industry. | Japan | liter | 640.00 | 5,958.91 | 9.31 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Copper Gleam (TM) HS-200B-1 (J) solution used in plating contains Copper Sulfate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and 75-85% water used in electronics industry | Japan | liter | 640.00 | 8,346.38 | 13.04 | View Importer | View Supplier |
| 30/Mar/2020 | 38249999 | Preparations used in plating COPPER GLEAM ST-901BM (water 80-90%; Oxyalkylene Polymer 1-10%; Copper sulfate 0.1-1%; Sulfuric acid <1%) | Japan | liter | 340.00 | 3,065.32 | 9.02 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | CuSO4 cleaning solution adheres to copper after product Copper Gleam HVS-202B (J) (water 85-95%; Polyalkylene glycol 5-15%; Polymer 1-5%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1can = 20 Liter) | Japan | liter | 1,280.00 | 40,396.80 | 31.56 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | Copper Gleam HVS-202A (J) copper plating surface brightening solution (water 90-99%; Formaldehyde 0.1-1%; Organic sulfur compound 0.1-1%; Sulfuric acid 0.1-1% ; Copper sulfate 0.1-1%) (1 can = 20 Liters) | Japan | liter | 960.00 | 20,160.00 | 21.00 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020122 # & Microfill EVF Brightener Solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 600.00 | 8,460.00 | 14.10 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020802 # & circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% | Taiwan | liter | 400.00 | 3,640.00 | 9.10 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020329 # & Copper Gleam (TM) HS-200B-1 (J) solution for plating containing Copper Sulphate 0.1-1%, Oxyalkylene Polymer 15-25%, Sulfuric acid 0.1-1% and water 75-85% Used in electronics industry | Japan | liter | 100.00 | 1,325.00 | 13.25 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020130 # & MICROFILL THF 100 B-1 (TM) solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
