| 30/Mar/2020 | 38249999 | Preparations used in plating to polish the surface of electroplated copper CUPROSTAR ST-2000 CORRECTOR (ingredients: sulfuric acid 1-10%, Organic salt 0.1-1%, copper su (according to ptpl No. 119 / TB-KĐHQ day) 10/05/2019) | Taiwan | liter | 200.00 | 5,200.00 | 26.00 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020122 # & Microfill EVF Brightener Solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 600.00 | 8,460.00 | 14.10 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020802 # & circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% | Taiwan | liter | 400.00 | 3,640.00 | 9.10 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020130 # & MICROFILL THF 100 B-1 (TM) solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 400.00 | 14,864.00 | 37.16 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 0 # & Chemical additives (increase the adhesion of the coating to s / p) used in plating, containing: 0.1-1% sulfuric acid, Sulfuric acid copper (2+) salt (1: 1), hydrate (1 : 5) 0.1-1%, (MACUSPEC VF-TH 200 WETTER) | Taiwan | liter | 800.00 | 32,064.00 | 40.08 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 0 # & Chemical additives (increasing the adhesion of the coating to s / p) used in plating: sulfuric acid 0.1-1%, sulfuric copper (2+) salt (1: 1), hydrate (1: 5) 0.1-1%, (MACUSPEC VF-TH 200 BR. REPL) | Taiwan | liter | 1,800.00 | 68,346.00 | 37.97 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 0 # & Chemical additives (increase the adhesion of the coating to s / p) used in plating: sulfuric acid 0.01-0.1%, Sulfuric acid copper (2+) salt (1: 1), hydrate (1: 5) 0.1-1%, (MacuSpec VF-TH200 Leveler REPL) | Taiwan | liter | 800.00 | 34,592.00 | 43.24 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020130 # & MICROFILL THF 100 B-1 (TM) solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 800.00 | 29,728.00 | 37.16 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020132 # & MICROFILL (TM) THF CARRIER SOLUTION contains water 80-90%; Sulfuric acid <1%; Copper sulfate <1%; Oxyalkylene Polymer 1-10% used in electroplating technology | Taiwan | liter | 800.00 | 36,032.00 | 45.04 | View Importer | View Supplier |
| 27/Mar/2020 | 38249999 | 07020131 # & MICROFILL THF LEVELER SOLUTION (TM) containing 90-99% Water, Sulfuric Acid <1.0%, Copper sulfate <1.0%, Imidazole polymer <1.0% used in electroplating technology | Taiwan | liter | 100.00 | 7,319.00 | 73.19 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020122 # & Microfill EVF Brightener Solution containing 90-99% Water, Sulfuric Acid 1-5%, Copper sulfate <1%, Formaldehyde 0.1 - <1% used in electroplating technology | Taiwan | liter | 800.00 | 11,280.00 | 14.10 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020123 # & Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1%, Sulfuric Acid 1-5%, Copper Sulfate <1% used in electroplating technology | Taiwan | liter | 1,000.00 | 18,820.00 | 18.82 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020802 # & circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% | Taiwan | liter | 300.00 | 2,730.00 | 9.10 | View Importer | View Supplier |
| 26/Mar/2020 | 38249999 | 07020330 # & Copper Gleam (TM) HS-200 Part A solution contains water90-99%; Sulfuric acid 0.1-1%; 1-Propanesulfonic acid, 3,3'dithiobis-, disodium sal 1-5%; Copper sulfate 0.1-1% for use in electronics industry | Taiwan | liter | 20.00 | 403.00 | 20.15 | View Importer | View Supplier |
