| 31/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-1,515) kg) | Taiwan | Lit | 1,500.00 | 21,150.00 | 14.10 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-505kg) | Taiwan | Lit | 500.00 | 9,410.00 | 18.82 | View Importer | View Supplier |
| 31/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% (20L / T-854kg) | Taiwan | Lit | 700.00 | 6,370.00 | 9.10 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200 Part A solution contains water90-99%; Sulfuric acid 0 , 1-1%; 1-Propanesulfonic acid , 3 , 3'dithiobis- , disodium sal 1-5%; Copper sulfate 0 , 1-1% used in electronics industry (20L / T) | Taiwan | Lit | 220.00 | 4,433.00 | 20.15 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% (20L / T-366kg) | Taiwan | Lit | 300.00 | 2,730.00 | 9.10 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-303kg) | Taiwan | Lit | 300.00 | 5,646.00 | 18.82 | View Importer | View Supplier |
| 28/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology (20L / T-303kg ) | Taiwan | Lit | 300.00 | 4,230.00 | 14.10 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200 Part A solution contains water90-99%; Sulfuric acid 0 , 1-1%; 1-Propanesulfonic acid , 3 , 3'dithiobis- , disodium sal 1-5%; Copper sulfate 0 , 1-1% used in electronics industry (20L / T) | Taiwan | Lit | 200.00 | 4,030.00 | 20.15 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Microfill EVF Leveler Solution contains 90-99% Water, Oxyalkylene Polymer <1% , Sulfuric Acid 1-5% , Copper Sulfate <1% used in electroplating technology (20L / T-606kg) | Taiwan | Lit | 600.00 | 11,292.00 | 18.82 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% (20L / T-488kg) | Taiwan | Lit | 400.00 | 3,640.00 | 9.10 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 840.00 | 3,864.00 | 4.60 | View Importer | View Supplier |
| 25/Jan/2019 | 38249999 | 3 # & CIRCUPOSIT P-6550A Electroless copper (Eless Cu) solution works to improve adhesion and surface quality, used in motherboard manufacturing technology (CuSO4: 10-20% , Sulfuric acid <1 % , Water: 80-90%) | Taiwan | Lit | 660.00 | 3,036.00 | 4.60 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | Circuposit (TM) MLB neutralizer 216-5 contains 60-70% water; Sulfuric acid 10-20%; Hydroxylammonium sulfate 1-10%; Glycolic acid 1-10% | Taiwan | Lit | 1,280.00 | 9,191.08 | 7.18 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | Copper Gleam (TM) HS-200 Part A solution contains water 90-99%; Sulfuric acid 0 , 1-1%; 1-Propanesulfonic acid , 3 , 3'dithiobis- , disodium sal 1-5%; Copper sulfate 0 , 1-1% used in electronics industry | Taiwan | Lit | 3,200.00 | 49,071.73 | 15.33 | View Importer | View Supplier |
| 24/Jan/2019 | 38249999 | Microfill EVF Brightener Solution contains 90-99% Water, Sulfuric Acid 1-5% , Copper sulfate <1% , Formaldehyde 0 , 1 - <1% used in electroplating technology | Taiwan | Lit | 640.00 | 5,149.63 | 8.05 | View Importer | View Supplier |
