| 31/Mar/2020 | 34029099 | MM04-007081 # & INPULSE CHEMICAL 2HFU LEVELLER (CONTAINED Sulfuric acid> = 0.5 - <1%) USED IN PLACEMENT PROCESS | China | kg | 100.00 | 6,000.00 | 60.00 | View Importer | View Supplier |
| 27/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 25/Mar/2020 | 34029099 | MM04-007081 # & INPULSE CHEMICAL 2HFU LEVELLER (CONTAINED Sulfuric acid> = 0.5 - <1%) USED IN PLACEMENT PROCESS | China | kg | 100.00 | 6,000.00 | 60.00 | View Importer | View Supplier |
| 16/Mar/2020 | 34029099 | MM04-007081 # & INPULSE CHEMICAL 2HFU LEVELLER (CONTAINED Sulfuric acid> = 0.5 - <1%) USED IN PLACEMENT PROCESS | China | kg | 100.00 | 6,000.00 | 60.00 | View Importer | View Supplier |
| 16/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 04/Mar/2020 | 34029099 | MM04-007081 # & INPULSE CHEMICAL 2HFU LEVELLER (CONTAINED Sulfuric acid> = 0.5 - <1%) USED IN PLACEMENT PROCESS | China | kg | 100.00 | 6,000.00 | 60.00 | View Importer | View Supplier |
| 03/Mar/2020 | 34059010 | 07010111 # & Clean Etch CPB-79-1 contains sulfuric acid (H2SO4) <5%, hydrogen peroxide (H2O2) 35% and water - used to support the surface grinding and polishing process. | Japan | kg | 20,000.00 | 36,800.00 | 1.84 | View Importer | View Supplier |
| 31/Jan/2019 | 34029014 | Cationic surfactants, liquid , MEC BRITE CB-5564 (Sulfuric acid (H2SO4) 5-9%) (20kg / can) | Japan | Kg | 640.00 | 11,200.00 | 17.50 | View Importer | View Supplier |
| 26/Jan/2019 | 34029019 | Metal surface cleaning preparations , for plating industry , in liquid form , consisting of 92% water , 4% sulfuric acid , 4% copper sulfate industrial substances) | Korea (Republic) | Kg | 100.00 | 945.00 | 9.45 | View Importer | View Supplier |
| 26/Jan/2019 | 34029019 | Metal surface cleaning preparations , for plating industry , in liquid form , containing 93.6% water , 3.2% sulfuric acid , 3.2% copper sulfate (goods exempt from pre-paid ETC) CN) | Korea (Republic) | Kg | 100.00 | 864.00 | 8.64 | View Importer | View Supplier |
| 22/Jan/2019 | 34029014 | Cationic surfactants, liquid , MEC BRITE CB-5564 (Sulfuric acid (H2SO4) 5-9%) (20kg / can) | Japan | Kg | 640.00 | 11,200.00 | 17.50 | View Importer | View Supplier |
| 18/Jan/2019 | 34021140 | Organic surface-active organics (MICOLIN LAS) , (Linear Alkyl benzene sulfonic acid 96% , Sulfuric Acid 1.5%). Sulphonated sulphonated alkylbenzene , not retail packed 210kg / carton.Cas 68584-22-5. 100% new goods | Korea (Republic) | Kg | 15,120.00 | 17,463.60 | 1.16 | View Importer | View Supplier |
| 11/Jan/2019 | 34029019 | Purifying preparations containing sulfuric acid, nonionic acid and additives (CP AC-100) (20KG / CAN) (Ingredients: DI water 95% , Surfuric acid 2% , Surfactant1% , Ethylene Glycol 2%) ( New products 100%) .Number: 42 / TB-KÐHQ | Korea (Republic) | Kg | 60.00 | 210.00 | 3.50 | View Importer | View Supplier |
| 11/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
| 08/Jan/2019 | 34059010 | Clean Etch grinding chemicals CPB-79-1 contain sulfuric acid (H2SO4) <5% , hydrogen peroxide (H2O2) 35% and water - used to support the grinding process , polishing the surface of the board. | Japan | Kg | 20,000.00 | 37,300.00 | 1.87 | View Importer | View Supplier |
