| 31/Mar/2020 | 28332500 | M2020700083, Copper Solution; Copper Solution, fixing the circuit board when plating (Sulfuric Acid <0.02-0.035%, Copper sulfate 35%; Polypropylene Glycol 5-15%; Hydrochloric Acid 0.002%), 1l / bottle, 100% new | Korea (Republic) | bottle / jar / tube | 10.00 | 1,848.18 | 184.82 | View Importer | View Supplier |
| 27/Mar/2020 | 28332500 | MM04-007514 # & CHEMICAL MJH V-CUPRUM A1 (CONTAINED Sulfuric acid 3 +/- 2%) USED FOR COPPER PLATING | Korea (Republic) | liter | 4,000.00 | 21,440.00 | 5.36 | View Importer | View Supplier |
| 23/Mar/2020 | 28332500 | CHEMICALS MJH V-CUPRUM A1 (CONTAINED Sulfuric acid 3 +/- 2%) USED TO COPPER | Korea (Republic) | liter | 220.00 | 1,179.20 | 5.36 | View Importer | View Supplier |
| 23/Mar/2020 | 28332500 | MM04-007514 # & CHEMICAL MJH V-CUPRUM A1 (CONTAINED Sulfuric acid 3 +/- 2%) USED FOR COPPER PLATING | Korea (Republic) | liter | 5,120.00 | 27,443.20 | 5.36 | View Importer | View Supplier |
| 11/Mar/2020 | 28332500 | MM04-007514 # & CHEMICAL MJH V-CUPRUM A1 (CONTAINED Sulfuric acid 3 +/- 2%) USED FOR COPPER PLATING | Korea (Republic) | liter | 420.00 | 2,251.20 | 5.36 | View Importer | View Supplier |
| 11/Mar/2020 | 28332500 | MM04-007514 # & CHEMICAL MJH V-CUPRUM A1 (CONTAINED Sulfuric acid 3 +/- 2%) USED FOR COPPER PLATING | Korea (Republic) | liter | 4,580.00 | 24,548.80 | 5.36 | View Importer | View Supplier |
