| 31/Mar/2020 | 85415000 | 486-4001-126 # & Semiconductor Ingots SP-TM-97551W # & VN | United States of America | pcs/piece | 600.00 | 5.40 | 0.01 | View Importer | View Supplier |
| 31/Mar/2020 | 85415000 | 486-4002-126 # & Semiconductor Ingots SP-TM-97552W # & VN | United States of America | pcs/piece | 600.00 | 5.04 | 0.01 | View Importer | View Supplier |
| 30/Mar/2020 | 85423900 | SBRS5654NT3G # & Semiconductor components # & VN | United States of America | pcs/piece | 100.00 | 5.00 | 0.05 | View Importer | View Supplier |
| 27/Mar/2020 | 85371019 | AM06-007488A # & Integrated circuits fitted with semiconductor components for CCTV. # & CN | United States of America | pcs/piece | 1.00 | 2.79 | 2.79 | View Importer | View Supplier |
| 27/Mar/2020 | 85444295 | 03-384727-14 # & Semiconductor wires used in telecommunication electronics, CBL ASSY, HOME RUN, BATH 4 DI, 03-384727-14 # & VN | United States of America | pcs/piece | 1.00 | 158.27 | 158.27 | View Importer | View Supplier |
| 27/Mar/2020 | 85444295 | 853-A17673-001 # & Semiconductor wires used in telecommunication electronics, CA, SIG, EIOC0 TO HF MATCH, INTFC, 853-A17673-001 # & VN | United States of America | pcs/piece | 1.00 | 172.81 | 172.81 | View Importer | View Supplier |
| 26/Mar/2020 | 7602000010 | Aluminum chips - (Aluminum foil residues on the outer edges of the IC board are removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Aluminum) # & VN | United States of America | kg | 3,320.00 | 1,792.80 | | View Importer | View Supplier |
| 26/Mar/2020 | 7602000010 | Aluminum scrap (Obtained during manufacturing for OSBD-BMD-008 processing contract with ON Semiconductor Trading Sárl) / DEFECTS SUBSTRATE (Aluminum) # & VN | United States of America | kg | 310.00 | 167.40 | | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Scrap mainly contains copper (Defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame)) / Dummy Defective HIC. Scrap in the percentage of loss, obtained in production value (Lot 226) # & VN | United States of America | kg | 564.00 | 524.52 | 0.93 | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Scrap mainly contains copper (defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame.)) / Dummy Defective IC. Scrap in the wastage ratio, obtained in production value (Lot 227) # & VN | United States of America | kg | 453.00 | 199.32 | 0.44 | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Copper chips - (Copper leftovers of the IC boards removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Copper) # & VN | United States of America | kg | 409.00 | 314.93 | 0.77 | View Importer | View Supplier |
| 25/Mar/2020 | 85419000 | 1551.0142 # & Quartz ring for semiconductor devices - HI13154 Flange Rev C # & VN | United States of America | pcs/piece | 1,245.00 | 68,475.00 | 55.00 | View Importer | View Supplier |
| 25/Mar/2020 | 85419000 | 1551.0141 # & Quartz ring for semiconductor devices - HI11919 Flange Rev E # & VN | United States of America | pcs/piece | 480.00 | 21,120.00 | 44.00 | View Importer | View Supplier |
| 25/Mar/2020 | 85419000 | 1551.0239 # & Quartz ring for semiconductor device HQTL-027740-001 Rev F # & VN | United States of America | pcs/piece | 4,680.00 | 42,120.00 | 9.00 | View Importer | View Supplier |
| 25/Mar/2020 | 85419000 | 1551.0269 # & Quartz ring for semiconductor devices - HQTA-101915 Rev 09 # & VN | United States of America | pcs/piece | 7,695.00 | 23,085.00 | 3.00 | View Importer | View Supplier |
