31/Mar/2020 | 85423900 | Printed circuit board model: CKP-1835-H-000 used to assemble, produce mobile phone headsets. 100% new goods. # & VN | Indonesia | pcs/piece | 30,000.00 | 4,929.00 | 0.16 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | RP45AP # & Electronic components (integrated electronic circuits) used to assemble mobile phone batteries, RP45AP, DTEP-10L # & VN | HongKong | pcs/piece | 100,000.00 | 17,180.00 | 0.17 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | RW02A # & Electronic components (integrated electronic circuits) used to assemble Mobile phone batteries, RW02A, DTEP 9W # & VN | HongKong | pcs/piece | 1,000,000.00 | 182,400.00 | 0.18 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | HABAA-00181 (2020EP-02) # & Printed circuit board model HABAA-00181 (EHS64) assembly used to assemble, produce mobile phone headsets New 100% # & VN | Vietnam | pcs/piece | 639,321.00 | 119,623.35 | 0.19 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | ACB-00033A (2020EP-02) # & Printed circuit board assembled model ACB-00033A (EHS-64UCFBE) used to assemble, produce mobile phone headsets 100% new. # & VN | Vietnam | pcs/piece | 19,846.00 | 4,035.29 | 0.20 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | HABAA-00188 (2020EP-02-B) # & Printed circuit board model: HABAA-00188 (EHS61 No bead) used to assemble, produce mobile phone headsets. New 100% # & VN | Vietnam | pcs/piece | 498,000.00 | 55,696.32 | 0.11 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | HAAAB-00165 (2020EP-02) # & Printed circuit board model: HAAAB-00165 (Heachi) used to assemble, produce mobile phone headsets. New 100% # & VN | Vietnam | pcs/piece | 3,920.00 | 1,750.28 | 0.45 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | HAAAB-00174 (2020EP-02) # & Printed circuit board model: HAAAB-00174 (K0.4) used to assemble, produce mobile phone headsets. New 100% # & VN | Vietnam | pcs/piece | 32,394.00 | 50,110.93 | 1.55 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | Integrated electronic circuit model: BES3001-SP, parameter: BGA 48-Ball, manufacturer of BES, used in manufacturing and assembling the phone headphone board. 100% new goods # & CN | China | pcs/piece | 18,000.00 | 7,380.00 | 0.41 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | Integrated electronic circuit model: Ic OSC SIT1572AI-J3-DCC-32.768Q, parameters: 32.768kHz XO.1.8V 4-UFBGA, manufacturer: SiTime used in manufacturing mobile phone board. 100% new goods # & TW | China | pcs/piece | 10,000.00 | 2,100.00 | 0.21 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | RW02A # & Electronic components for assembling mobile phone batteries, RW02A, DTEP 9W # & VN | Korea (Republic) | pcs/piece | 106,092.00 | 19,351.18 | 0.18 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | MP24AD-G # & Electronic component (integrated electronic circuit) used to assemble Mobile phone batteries, MP24AD, Tep-5L # & VN | Korea (Republic) | pcs/piece | 30,000.00 | 2,247.00 | 0.07 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | SP45AM-G # & Electronic components (integrated electronic circuits) used to assemble Mobile phone batteries, SP45AM, TEP-6L # & VN | Korea (Republic) | pcs/piece | 10,000.00 | 1,200.00 | 0.12 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | UP24AD-G # & Electronic components (integrated electronic circuits) used to assemble Mobile phone batteries, UP24AD, UTEP 6L # & VN | Korea (Republic) | pcs/piece | 10,000.00 | 1,162.00 | 0.12 | View Importer | View Supplier |
31/Mar/2020 | 85423900 | LP06AB-G # & Electronic component (integrated electronic circuit) used to assemble Mobile phone batteries, LP06AB, LTEP-8L # & VN | Korea (Republic) | pcs/piece | 40,000.00 | 6,912.00 | 0.17 | View Importer | View Supplier |