| 25/Mar/2020 | 85429000 | EP10-004414 # & Chips for cctv boards. selling and liquidating inventories from DH No. tk 103162689450 on 24/02/2020) # & CN | Korea (Republic) | pcs/piece | 100.00 | 22.00 | 0.22 | View Importer | View Supplier |
| 21/Mar/2020 | 85429000 | MV26 # & Con IC of Camera Module (camera for video recording), manufacturer: ON SEMI, NVL used to produce camera. Returned goods in line 11 of tk 103192936010 # & US | Korea (Republic) | pcs/piece | 4,250.00 | 231.63 | 0.05 | View Importer | View Supplier |
| 21/Mar/2020 | 85429000 | MV28 # & Connector pin of camera module (video camera), manufacturer: HIROSE, NVL used to produce camera. Export and return on line 12 of tk 103192936010 # & JP | Korea (Republic) | pcs/piece | 4,250.00 | 397.38 | 0.09 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SHG52AA00001 # & Semiconductor chip used in semiconductor chip manufacturing technology (WAFER), SHG52AA00001 returned part of the product line 3 TK 103157270640 / E11 on 20.2.2020 # & KR | Korea (Republic) | pcs/piece | 514.00 | 5.14 | 0.01 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SDG45EA40001 # & Semiconductor chips used in semiconductor chip manufacturing technology (WAFER), SDG45EA40001 returned part of the product line 4 TK 103157270640 / E11 on 20.2.2020 # & KR | Korea (Republic) | pcs/piece | 1,214.00 | 13.35 | 0.01 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SHG89XA40001 # & Semiconductor chip used in semiconductor chip manufacturing technology (WAFER), 200um (+ -) 10um thick, CSP stage, SHG89XA40001 returned part 3 of the product line 3 TK 103172945520 / E11 on February 28, 2020 # & KR | Korea (Republic) | pcs/piece | 91,819.00 | 1,101.83 | 0.01 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SHG56BA00001 # & Semiconductor chips used in the technology of manufacturing semiconductor chips (WAFER) with a thickness of 200um (+ -) 10um, stage CSP, SHG56BA00001 returned part of the line 4 TK 103172945520 / E11 on February 28, 2020 # & KR | Korea (Republic) | pcs/piece | 39,117.00 | 391.17 | 0.01 | View Importer | View Supplier |
| 17/Mar/2020 | 85429000 | SWG42EPM0H01 # & Semiconductor chips used in semiconductor chip manufacturing (WAFER) technology, 200um (+ -) 10um thick; stages CSP, SWG42EPM0H01 return part of the product line 7 TK 103192873010 / E11 on October 10, 2020 # & KR | Korea (Republic) | pcs/piece | 181,464.00 | 5,080.99 | 0.03 | View Importer | View Supplier |
| 09/Mar/2020 | 85429000 | EP10-003438 # & Chip W29GL064CT7S, used to assemble the board (liquidation and sale of inventories from DH No. 22 tk 102441735650 on January 15, 2019) # & KR | Korea (Republic) | pcs/piece | 300.00 | 262.65 | 0.88 | View Importer | View Supplier |
| 09/Mar/2020 | 85429000 | EP10-004195 # & Chip TPS7A9001DSKR, used to assemble the board. (Release and sale of inventories from DH No. 14 tk 103136336000 on 06/02/2020) # & CN | Korea (Republic) | pcs/piece | 1,000.00 | 400.00 | 0.40 | View Importer | View Supplier |
| 09/Mar/2020 | 85429000 | EP10-003423 # & Chip TL8211FS, used to assemble the board. (sell and liquidate inventories from DH No. 26 tk 102967658840 on November 4, 2019) # & HK | Korea (Republic) | pcs/piece | 400.00 | 372.00 | 0.93 | View Importer | View Supplier |
| 09/Mar/2020 | 85429000 | EP10-004463 # & MP23701GQEU Chip used to assemble electronic board. (Export liquidation of inventories from DH No. 1 tk 103170652800 on February 28, 2020) # & CN | Korea (Republic) | pcs/piece | 3,000.00 | 495.00 | 0.17 | View Importer | View Supplier |
| 09/Mar/2020 | 85429000 | EP10-004910 # & Chip ADG1636BCPZ, used for CCTV board. (sales liquidation of inventories from DH No. 2 t 103179652920 on 04/03/2020) # & KR | Korea (Republic) | pcs/piece | 800.00 | 784.00 | 0.98 | View Importer | View Supplier |
