| 26/Mar/2020 | 7602000010 | Aluminum chips - (Aluminum foil residues on the outer edges of the IC board are removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Aluminum) # & VN | United States of America | kg | 3,320.00 | 1,792.80 | | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Copper chips - (Copper leftovers of the IC boards removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Copper) # & VN | United States of America | kg | 409.00 | 314.93 | 0.77 | View Importer | View Supplier |
| 19/Mar/2020 | 39269099 | Silver plastic tubing (obtained during IC chip manufacturing) # & VN | Japan | kg | 12.40 | 792.76 | 63.93 | View Importer | View Supplier |
| 19/Mar/2020 | 74040000 | Scrap copper chips chips (obtained during IC chip manufacturing) (FRAME) # & VN | Japan | kg | 1,635.80 | 33,783.93 | 20.65 | View Importer | View Supplier |
| 19/Mar/2020 | 74040000 | Scrap scrap of chip mounting frames (obtained during the production of HPSD ICs) (Frame Cu) # & VN | Japan | kg | 3,385.60 | 11,413.92 | 3.37 | View Importer | View Supplier |
| 19/Mar/2020 | 74040000 | Scrap copper of IC chips finely ground mixed with resin (obtained during IC chip manufacturing) (Bali resin) # & VN | Japan | kg | 675.20 | 5,139.23 | 7.61 | View Importer | View Supplier |
| 19/Mar/2020 | 74040000 | Copper scrap of HPSD IC (Dummy Cu) IC mounting frame is obtained during IC chip manufacturing. | Japan | kg | 414.00 | 222.85 | 0.54 | View Importer | View Supplier |
