| Date | HS Code | Product Description | Destination Country | Unit | Quantity | Total Value [USD] | Unit Price [USD] | Importer Name | Supplier Name |
|---|---|---|---|---|---|---|---|---|---|
| 26/Mar/2020 | 7602000010 | Aluminum chips - (Aluminum foil residues on the outer edges of the IC board are removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Aluminum) # & VN | United States of America | kg | 3,320.00 | 1,792.80 | View Importer | View Supplier | |
| 26/Mar/2020 | 85481030 | Copper chips - (Copper leftovers of the IC boards removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Copper) # & VN | United States of America | kg | 409.00 | 314.93 | 0.77 | View Importer | View Supplier |
