| 26/Mar/2020 | 85481030 | Scrap mainly contains copper (Defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame)) / Dummy Defective HIC. Scrap in the percentage of loss, obtained in production value (Lot 226) # & VN | United States of America | kg | 564.00 | 524.52 | 0.93 | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Scrap mainly contains copper (defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame.)) / Dummy Defective IC. Scrap in the wastage ratio, obtained in production value (Lot 227) # & VN | United States of America | kg | 453.00 | 199.32 | 0.44 | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Defective semi-conductor components (including main NVL: 01: Printed circuit and 01: IC leg frame. Mainly contains copper) / Dummy Defective IC (EBR). Production process (Lot 228) # & VN | United States of America | kg | 536.00 | 1,527.60 | 2.85 | View Importer | View Supplier |
| 26/Mar/2020 | 85489090 | Granular compounds used for electrolysis / Tin Ballas - Used, removed during manufacturing process (Lot 263) # & VN | United States of America | kg | 768.00 | 921.60 | 1.20 | View Importer | View Supplier |
| 26/Mar/2020 | 85481030 | Copper chips - (Copper leftovers of the IC boards removed - Obtained during manufacturing for OSBD-BMD-008 machining contract with ON Semiconductor Trading Sárl)) / CUT SUBSTRATE (Copper) # & VN | United States of America | kg | 409.00 | 314.93 | 0.77 | View Importer | View Supplier |
| 12/Mar/2020 | 85481030 | Scrap mainly contains copper (Defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame)) / Dummy Defective HIC. Scrap in the percentage of loss, obtained in production value (Lot 226) # & VN | United States of America | kg | 1,099.00 | 1,022.07 | 0.93 | View Importer | View Supplier |
| 12/Mar/2020 | 85489090 | Damaged transistors (taped on double-sided tape to machine tools, removed after QTGC) / Defective Wafer / Dies (1kg ~ 20000 pieces). Scrap in the percentage of loss, obtained in production value (Lot 33) # & VN | United States of America | kg | 141.00 | 1,128.00 | 8.00 | View Importer | View Supplier |
| 12/Mar/2020 | 85489090 | Defective semi-conductor components (including main materials: 01: Printed circuit - defective during manufacture) / Defective Substrate and Wire.PL in the loss rate, obtained in production value (Lot 202) # &VN | United States of America | kg | 373.00 | 201.42 | 0.54 | View Importer | View Supplier |
| 12/Mar/2020 | 85489090 | Granular compounds used for electrolysis / Tin Ballas - Used, removed during manufacturing process (Lot 263) # & VN | United States of America | kg | 651.00 | 781.20 | 1.20 | View Importer | View Supplier |
| 05/Mar/2020 | 85481030 | Scrap mainly contains copper (Defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame)) / Dummy Defective HIC. Scrap in the percentage of loss, obtained in production value (Lot 226) # & VN | United States of America | kg | 637.00 | 280.28 | 0.44 | View Importer | View Supplier |
| 05/Mar/2020 | 85481030 | Scrap mainly contains copper (defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame.)) / Dummy Defective IC. Scrap in the wastage ratio, obtained in production value (Lot 227) # & VN | United States of America | kg | 481.00 | 1,370.85 | 2.85 | View Importer | View Supplier |
| 05/Mar/2020 | 85489090 | Defective semi-conductor components (including main materials: 01: Printed circuit - defective during manufacture) / Defective Substrate and Wire.PL in the loss rate, obtained in production value (Lot 202) # &VN | United States of America | kg | 401.00 | 232.58 | 0.58 | View Importer | View Supplier |
| 05/Mar/2020 | 85489090 | Granular compounds used for electrolysis / Tin Ballas - Used, removed during manufacturing process (Lot 263) # & VN | United States of America | kg | 816.00 | 1,346.40 | 1.65 | View Importer | View Supplier |
| 31/Jan/2019 | 85481030 | Faulty semi-conductor components (including main NVL: 01: Printed circuit and 01: IC pin frame) / Substrate with Frame. Scrap in the rate of loss, obtained during production (Lot 226) # & VN " | United States of America | Kg | 615.00 | 270.60 | 0.44 | View Importer | View Supplier |
| 31/Jan/2019 | 85481030 | Scrap mainly contains copper (defective semi-finished semiconductor components (including main NVL: 01: Printed circuit and 01: IC leg frame.)) / Dummy Defective IC. Scrap in the percentage of loss, earned in production value (Lot 227) # & VN " | United States of America | Kg | 384.00 | 940.80 | 2.45 | View Importer | View Supplier |
